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    EP4SGX180KF40C3N

    EP4SGX180KF40C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX100-3FGG484C

    XC6SLX100-3FGG484C

    XC6SLX100-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5G test PCB

    5G test PCB

    Most of 5g products need 5g test PCB, which can be used normally after debugging. Therefore, 5g test PCB has become a popular product. Hontec specializes in producing communication PCB.
  • TPS22975DSGR

    TPS22975DSGR

    TPS22975DSGR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HD Camera Rigid-Flex PCB

    HD Camera Rigid-Flex PCB

    The characteristics of the combination of hard and soft boards determine that its application areas cover all the application areas of FPC on PCBs, such as: mobile phones, key boards and side buttons, computers and LCD screens, motherboards and display screens, CD Walkman, magnetic Disc player, NOTEBOOK. The newest components are HDD, suspension circuit of hard disk drive (Su ensi.N cireuit) and xe package board. The following is about HD Camera Rigid-Flex PCB related, I hope to help you better understand HD Camera Rigid-Flex PCB.
  • XC6SLX25-L1CSG324I

    XC6SLX25-L1CSG324I

    XC6SLX25-L1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • What characteristics do semiconductor materials possess

    Semiconductor materials refer to materials with special electrical properties in electronics and quantum mechanics, including silicon, germanium, silicon nitride, gallium selenide, etc. The special properties of these materials enable them to be used as materials in electronic devices, such as transistors, diodes, solar cells, etc.

  • Development of printed circuit board substrate materials

    The development of printed circuit board substrate materials has gone through nearly 50 years

  • Understand the structure of heavy copper PCB

    Heavy copper PCBs are manufactured with 4 ounces or more of copper on each layer. 4 ounce copper PCBs are most commonly used in commercial products. The concentration of copper can be as high as 200 ounces per square foot.

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • What are the advantages of flexible FPC circuit board

    As the name suggests, FPC flexible printed circuit board has the function of bending and using, and can be made into a three-dimensional space. Therefore, theoretically, only one FPC flexible circuit board / FPC flexible board can complete the overall wiring work in one machine.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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