Ro4350B high frequency PCB Manufacturers

Adhering into the theory of "quality, services, efficiency and growth", now we have gained trusts and praises from domestic and international shopper for Ro4350B high frequency PCB,Rogers high frequency PCB,Taconic high frequency PCB,Arlon high frequency PCB, Our really specialized process eliminates the component failure and offers our shoppers unvarying top quality, allowing us to control cost, plan capacity and maintain consistent on time delivery.
Ro4350B high frequency PCB, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective products and meticulous after-sales service. We firmly believe that: we are outstanding as we are specialized.

Hot Products

  • Red High speed Backplane

    Red High speed Backplane

    Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.
  • 10AX066H3F34I2SG

    10AX066H3F34I2SG

    ​10AX066H3F34I2SG,Belonging to the Intel Arria 10 GX device series, this series combines high performance and power efficiency, manufactured using a 20nm process
  • XCKU085-1FLVA1517I

    XCKU085-1FLVA1517I

    ​Best balance. XCKU085-1FLVA1517I is an ideal choice for packet processing and DSP intensive features, suitable for various applications from wireless MIMO technology to Nx100G networks and data centers.
  • XCVU11P-1FLGB2104I

    XCVU11P-1FLGB2104I

    XCVU11P-1FLGB2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications

Send Inquiry