8-layer 2-step drone HDI PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for 8-layer 2-step drone HDI PCB,8-layer robot 3-step HDI PCB,HD camera HDI PCB,HDI PCB, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
8-layer 2-step drone HDI PCB, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we are going to continue to develop, to offer the high-quality products and solutions and services, and promote lasting cooperation with our customers, common development and create a better future.

Hot Products

  • 5CSEBA6U23C7N

    5CSEBA6U23C7N

    5CSEBA6U23C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SE110F1152I3N

    EP3SE110F1152I3N

    EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU9EG-2FFVC900I

    XCZU9EG-2FFVC900I

    XCZU9EG-2FFVC900I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 600,000 logic cells, 34.6 Mb of block RAM, and 1,248 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications.
  • XC3S1600E-4FGG320C

    XC3S1600E-4FGG320C

    ​XC3S1600E-4FGG320C is an FPGA (Field Programmable Gate Array) belonging to the Spartan-3E series, designed specifically to meet the needs of high-capacity, cost sensitive consumer electronics products. It has the following key characteristics:
  • XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C

    XC6SLX45-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MT41K256M8DA-125IT:K

    MT41K256M8DA-125IT:K

    MT41K256M8DA-125IT:K is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry