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HDI PCB, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

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XCVU190-1FLGA2577I
XCVU190-1FLGA2577I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. Here is a brief introduction to the chip:
XC3SD3400A-4CSG484I
XC3SD3400A-4CSG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCVU27P-2FSGA2577E
XCVU27P-2FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control,
XC7A12T-2CPG238C
The XC7A12T-2CPG238C is optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications.
XCKU3P-2SFVB784I
XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
XC3S200AN-5FTG256C
XC3S200AN-5FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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High Frequency PCB processing attention points
High Frequency PCB processing attention points.
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
The introduction of the high speed board
HONTEC is one of leading High-speed Board manufacture, who specializes in high-mix,low volume and quickturn prototype PCB for high-tech industries in 28 countries.(China high speed board）
What is the future development prospect of chips in China
Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.
What are the characteristics of semiconductor materials?
The resistivity of semiconductors changes significantly with temperature. For example, pure germanium, for every 10 degrees increase in humidity, its electrical resistivity decreases to 1/2 of its original value.
Semiconductor returned with strength, underestimated value increased with high growth
At the end of April 2022, we opened a special column called "when the weather turns good, we will copy the bottom 2022". By the end of June, we have focused more on the new energy industry tracks, including the upstream and downstream industrial chain of lithium batteries for new energy vehicles

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HDI PCB Manufacturers

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Hot Products

XCVU190-1FLGA2577I

XC3SD3400A-4CSG484I

XCVU27P-2FSGA2577E

XC7A12T-2CPG238C

XCKU3P-2SFVB784I

XC3S200AN-5FTG256C

High Frequency PCB processing attention points

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

The introduction of the high speed board

What is the future development prospect of chips in China

What are the characteristics of semiconductor materials?

Semiconductor returned with strength, underestimated value increased with high growth

Merry 2020-08-14 11:02:58

Hazel 2022-06-01 05:58:05

Miranda 2024-03-19 06:09:05

Andrew 2022-06-30 23:45:10

jari dedenroth 2020-06-12 01:38:04

Hellyngton Sato 2023-08-19 04:47:20

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.