22-layer ELIC HDI PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for 22-layer ELIC HDI PCB,4-layer any layer HDI PCB,8-layer any interconnection HDI PCB, We can do your customized order to meet your own satisfactory! Our company sets up several departments, including production department, sales department, quality control department and sevice center, etc.
22-layer ELIC HDI PCB, Further, we've been supported by highly experienced and knowledgeable professionals, who have immense expertise in their respective domain. These professionals work in close coordination with each other to provide our clients an effective range of goods.

Hot Products

  • 5G test PCB

    5G test PCB

    Most of 5g products need 5g test PCB, which can be used normally after debugging. Therefore, 5g test PCB has become a popular product. Hontec specializes in producing communication PCB.
  • XC6SLX25-3FTG256C

    XC6SLX25-3FTG256C

    XC6SLX25-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCV100E-6FG256C

    XCV100E-6FG256C

    XCV100E-6FG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • built-in Copper Coin PCB

    built-in Copper Coin PCB

    built-in Copper Coin PCB-- HONTEC uses prefabricated copper blocks to splice with FR4, then uses resin to fill and fix them, and then combines them perfectly by copper plating to connect them with the circuit copper
  • EP4SGX230HF35C4G

    EP4SGX230HF35C4G

    This chip provides 230K logic units and integrates multiple high-speed communication interfaces such as PCIe 2.0 x8, high-speed serial connectors DDR3 memory controller, etc. The chip adopts manufacturing technology based on the 40 nanometer process, which has advantages such as efficient processing capacity, low power EP4SGX230HF35C4G consumption, and low cost. This chip has a wide range of applications in high-performance computing, network communication, video transcoding, and image processing.
  • EP2S60F672I4N

    EP2S60F672I4N

    EP2S60F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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