8-layer any interconnection HDI PCB Manufacturers

The very rich projects management experiences and one to one service model make the high importance of business communication and our easy understanding of your expectations for 8-layer any interconnection HDI PCB,22-layer ELIC HDI PCB,4-layer any layer HDI PCB, Our tenet is evident each of the time: to provide good quality solution at competitive rate to clients throughout the planet. We welcome potential purchasers to call us for OEM and ODM orders.
8-layer any interconnection HDI PCB, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our goods are favored by domestic and foreign customers. With your support, we are going to build a better tomorrow!

Hot Products

  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • XCVU5P-3FLVB2104E

    XCVU5P-3FLVB2104E

    ​XCVU5P-3FLVB2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx (or AMD/Xilinx, as AMD acquired Xilinx in 2019). Here is a brief introduction to the chip:
  • XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCV100-4TQ144I

    XCV100-4TQ144I

    XCV100-4TQ144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • SN74ALVTH16373VR

    SN74ALVTH16373VR

    SN74ALVTH16373VR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS54361QDPRTQ1

    TPS54361QDPRTQ1

    TPS54361QDPRTQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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