4-layer high precision HDI PCB Manufacturers

Our growth depends within the innovative equipment, fantastic talents and repeatedly strengthened technology forces for 4-layer high precision HDI PCB,8-layer resin plug hole PCB,12-layer copper paste plug PCB, Our experienced specialized workforce will probably be wholeheartedly at your provider. We sincerely welcome you to check out our web-site and organization and mail us your inquiry.
4-layer high precision HDI PCB, we sincerely hope to establish a good and long-term business relationship with your esteemed company through this opportunity, based on equality, mutual benefit and win-win business from now to the future. "Your satisfaction is our happiness".

Hot Products

  • 10AX016E4F29E3SG

    10AX016E4F29E3SG

    ​10AX016E4F29E3SG is an FPGA (Field Programmable Gate Array) with the specific model Arria 10 GX 160. This FPGA belongs to the product series of Intel (formerly Altera) and has the following characteristics and technical parameters
  • EP4CE30F29C6N

    EP4CE30F29C6N

    EP4CE30F29C6N is a FPGA (Field Programmable Gate Array) device of the Cyclone IV series. ‌
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM88682CA1KFSBG

    BCM88682CA1KFSBG

    ​BCM88682CA1KFSBG is an electronic component designed and produced by Broadcom brand, with the following characteristics:
  • BCM56565B0KFSBG

    BCM56565B0KFSBG

    BCM56565B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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