8-layer resin plug hole PCB Manufacturers

To be able to ideal meet up with client's needs, all of our operations are strictly performed in line with our motto ""High High-quality, Competitive Cost, Fast Service"" for 8-layer resin plug hole PCB,4-layer high precision HDI PCB,12-layer copper paste plug PCB, Our enterprise is dedicated to providing prospects with superior and stable top quality items at competitive selling price, producing each and every customer content with our services and products.
8-layer resin plug hole PCB, You can let us know your idea to develop unique design for your own model to prevent too much similar parts in the market! We are going to give our best service to satisfy all your needs! Remember to contact us right away!

Hot Products

  • EP4CE15F17C8N

    EP4CE15F17C8N

    ​EP4CE15F17C8N Cyclone IV equipment is available in commercial grade, industrial grade, extended industrial grade, and automotive grade. The Cyclone IV E device offers speed levels of -6 (fastest), -7, -8, -8L, and -9L. Provide -6 (fastest), -7, -8, -8L, and -9L speed levels for commercial equipment, -8L speed level for industrial equipment, and -7 speed level for expanding industrial and automotive equipment. The Cyclone IV GX equipment offers commercial equipment at -6 (fastest), -7, and -8 speed levels, as well as industrial equipment at -7 speed leve
  • 18 Layer Oversized size PCB

    18 Layer Oversized size PCB

    18 Layer Oversized size PCB generally refers to a circuit board with a long side exceeding 650MM and a wide side exceeding 520MM. However, with the development of market demand, many multilayer circuit boards exceed 1000MM. The following is about 18 Layer Oversized PCB related, I hope to help you better understand 18 Layer Oversized PCB.
  • N4000-13SI PCB

    N4000-13SI PCB

    N4000-13SI PCB is a kind of high Tg material developed by nelco company of the United States. It is used for the production of high-performance PCB substrate. It is mainly high density and light weight, suitable for aviation and aerospace products
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCF08PVOG48C

    XCF08PVOG48C

    XCF08PVOG48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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