20-layer 6step HDI PCB Manufacturers

During the past few years, our business absorbed and digested state-of-the-art technologies the two at home and abroad. Meanwhile, our firm staffs a group of experts devoted to your development of 20-layer 6step HDI PCB,18-layer 3step HDI PCB,24layer 4step HDI PCB,High Density Interconnect PCB, We've been devoted to offer professional purification technology and methods in your case!
20-layer 6step HDI PCB, In the increasingly competitive market, With sincere service high quality merchandise and well-deserved reputation, we always supply customers support on items and techniques to achieve long-term cooperation. Living by quality, development by credit is our eternal pursuit, We firmly believe that after your visit we'll become long-term partners.

Hot Products

  • BCM56340A0KFSBLG

    BCM56340A0KFSBLG

    BCM56340A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SL200F1152I3N

    EP3SL200F1152I3N

    ​EP3SL200F1152I3N is an FPGA (Field Programmable Gate Array) chip produced by Altera, belonging to the Stratix III series. This chip has the following characteristics and specifications
  • High-power LED ceramic PCB

    High-power LED ceramic PCB

    High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.
  • XC3S1000-4FTG256C

    XC3S1000-4FTG256C

    XC3S1000-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • R-5725S PCB

    R-5725S PCB

    R-5725S PCB If there are high speed transition edges in the design, the problem of transmission line effects on the PCB must be considered. The fast integrated circuit chip with a high clock frequency that is commonly used now has such a problem. The following is about Supercomputer High speed PCB related, I hope to help you better understand Supercomputer High speed PCB.

Send Inquiry