18-layer 3step HDI PCB Manufacturers

continue to improve, to ensure product quality in line with market and customer standard requirements. Our company has a quality assurance system have been established for 18-layer 3step HDI PCB,20-layer 6step HDI PCB,24layer 4step HDI PCB,High Density Interconnect PCB, We recognize your enquiry and it truly is our honor to work with each and every pal globally.
18-layer 3step HDI PCB, To create more creative products and solutions, maintain high-quality goods and update not only our products and solutions but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we present and to grow stronger together. To be the real winner, starts here!

Hot Products

  • 22Layer RF PCB

    22Layer RF PCB

    22Layer RF PCB a radiofrequenza HONTEC lavora a stretto contatto con il team di progettazione del prodotto per garantire che gli obiettivi di costo/prestazioni del progetto siano raggiunti fornendo informazioni sulle opzioni dei materiali, sui costi relativi e sui problemi DFM. Nella foto, 22L RF - Materiale per radiofrequenza; THK: 2,45 mm; finitura superficiale: ENIG; controllo dell'impedenza.
  • XCKU11P-1FFVE1517I

    XCKU11P-1FFVE1517I

    XCKU11P-1FFVE1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8423PTT

    HI-8423PTT

    HI-8423PTT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU27P-2FSGA2577E

    XCVU27P-2FSGA2577E

    ​XCVU27P-2FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control,
  • XC7A15T-2CPG236I

    XC7A15T-2CPG236I

    XC7A15T-2CPG236I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I

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