18-layer 3step HDI PCB Manufacturers

continue to improve, to ensure product quality in line with market and customer standard requirements. Our company has a quality assurance system have been established for 18-layer 3step HDI PCB,20-layer 6step HDI PCB,24layer 4step HDI PCB,High Density Interconnect PCB, We recognize your enquiry and it truly is our honor to work with each and every pal globally.
18-layer 3step HDI PCB, To create more creative products and solutions, maintain high-quality goods and update not only our products and solutions but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we present and to grow stronger together. To be the real winner, starts here!

Hot Products

  • MTFC32GAKAENA-4MIT

    MTFC32GAKAENA-4MIT

    MTFC32GAKAENA-4MIT code JWB98 imported original BGA-100 MICRON EMMC storage electronic components chip
  • XCZU4CG-1SFVC784E

    XCZU4CG-1SFVC784E

    ​The XCZU4CG-1SFVC784E multiprocessor has 64 bit processor scalability and combines real-time control with software and hardware engines, making it suitable for graphics, video, waveform, and packet processing applications. This multiprocessor system on chip device is based on a platform equipped with a general-purpose real-time processor and programmable logic
  • 10AX048H3F34I2SG

    10AX048H3F34I2SG

    ​10AX048H3F34I2SG Hongtai Quick Electronics is 100% in stock with a complete range of products. We only offer original products with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications
  • L6202

    L6202

    L6202 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z020-3CLG484E

    XC7Z020-3CLG484E

    ​The XC7Z020-3CLG484E embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.

Send Inquiry