XC7K410T-2FFG676I provides the best cost-effectiveness and low power consumption for rapidly growing applications and wireless communication. The Kindex-7 FPGA boasts excellent performance and connectivity, priced at the same level as previously limited to the highest capacity applications.
XC7K410T-2FFG676I provides the best cost-effectiveness and low power consumption for rapidly growing applications and wireless communication. The Kindex-7 FPGA boasts excellent performance and connectivity, priced at the same level as previously limited to the highest capacity applications.
The Kindex-7 FPGA allows designers to build excellent bandwidth and 12 bit digital programmable analog while meeting cost and power requirements. The unique power consumption of the 144GMACS Digital Signal Processor (DSP) makes the multifunctional Kinex-7 device an ideal choice for portable ultrasound devices and next-generation communication applications. The Kindex-7 FPGA provides a peak serial bandwidth of 800Gbps (full duplex), including a CPRI/OBSAI IP core optimized for distributed baseband architecture (9.8Gbps). Programmable Kindex-7 devices can also be easily reconfigured to support multiple wireless interfaces, such as LTE, WiMAX, and WCDMA.
The Kindex-7 comes with built-in support for 8-channel PCI Express (Gen1/Gen2) for connecting to host systems. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture has universal components, including logic structure, Block RAM, DSP, clock, analog mixed signal (AMS), and fast target changing within the 7 series. The Kindex-7 FPGA architecture greatly shortens development time, allowing designers to focus on product differentiation and new projects for migration.
specifications
Series: Kindex ®- seven
Packaging: pallets
LAB/CLB number: 31775
Logic components/number of units: 406720
Total RAM bits: 29306880
I/O count: 400
Voltage - Power supply: 0.97V~1.03V
Installation type: Surface mount type
Working temperature: -40 ° C~100 ° C (TJ)
Package/Shell: 676-BBGA, FCBGA
Supplier Device Packaging: 676-FCBGA (27x27)
