High Density Interconnect PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for High Density Interconnect PCB,18-layer 3step HDI PCB,20-layer 6step HDI PCB,24layer 4step HDI PCB, Adhering on the company principle of mutual gains, we have won superior popularity amid our shoppers because of our excellent products and services, excellent products and aggressive selling prices. We warmly welcome shoppers from home and overseas to cooperate with us for common achievements.
High Density Interconnect PCB, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • XCZU3EG-2SFVC784I

    XCZU3EG-2SFVC784I

    XCZU3EG-2SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • S1D13700F02A100

    S1D13700F02A100

    S1D13700F02A100 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • P5040NXN72QC

    P5040NXN72QC

    P5040NXN72QC is a microchip launched by NXP, operating temperature -40°C~105°C(TA), speed 2.2GHz, supplier device package 1295-FCPBGA(37.5x37.5)
  • XC5VLX20T-1FF323C

    XC5VLX20T-1FF323C

    XC5VLX20T-1FF323C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MTFC32GAPALNA-AAT

    MTFC32GAPALNA-AAT

    MTFC32GAPALNA-AAT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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