High Density Interconnect PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for High Density Interconnect PCB,18-layer 3step HDI PCB,20-layer 6step HDI PCB,24layer 4step HDI PCB, Adhering on the company principle of mutual gains, we have won superior popularity amid our shoppers because of our excellent products and services, excellent products and aggressive selling prices. We warmly welcome shoppers from home and overseas to cooperate with us for common achievements.
High Density Interconnect PCB, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Hot Products

  • EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TPS22975DSGR

    TPS22975DSGR

    TPS22975DSGR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-1CSG324I

    XC7A35T-1CSG324I

    XC7A35T-1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4CE10F17I7N

    EP4CE10F17I7N

    ​The EP4CE10F17I7N Cyclone IV E equipment provides speed levels of -6, -7, -8, -8L, and -9L for commercial equipment, -8L for industrial equipment, and -7 for expanding industrial and automotive equipment
  • BCM6756A1KFEBG

    BCM6756A1KFEBG

    BCM6756A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.BCM6756A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.

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