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8-layer 3Step HDI PCB Manufacturers

With this motto in mind, we've turn into one of quite possibly the most technologically innovative, cost-efficient, and price-competitive manufacturers for 8-layer 3Step HDI PCB,Cross Blind Buried Hole PCB,6-layer any interconnection PCB,HDI PCB,4Step HDI PCB, "Quality", "honesty" and "service" is our principle. Our loyalty and commitments remain respectfully at your support. Speak to Us Today For even more facts, get in touch with us now.
8-layer 3Step HDI PCB, We always stick to the tenet of "sincerity, high quality, high efficiency, innovation". With years of efforts, we have established friendly and stable business relationships with worldwide customers. We welcome any of your inquiries and concerns for our merchandise, and we have been sure that we'll supply just what you want, as we always believe that your satisfaction is our success.

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    XCKU060-1FFVA1517C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 59,520 logic cells, 17.2 Mb of distributed RAM, 360 Digital Signal Processing (DSP) slices, and 1122 user input/output pins. It operates on a 0.95V to 1.05V power supply and supports various I/O standards such as LVCMOS, HSTL, and PCI Express.
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    EP2C35F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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