6-layer any interconnection PCB Manufacturers

We have been proud from the higher consumer gratification and wide acceptance due to our persistent pursuit of high quality both on product or service and service for 6-layer any interconnection PCB,8-layer 3Step HDI PCB,Cross Blind Buried Hole PCB,HDI PCB,4Step HDI PCB, With the eternal goal of "continuous quality improvement, customer satisfaction", we are sure that our product quality is stable and reliable and our products are best-selling at home and abroad.
6-layer any interconnection PCB, We will supply much better products with diversified designs and professional services. At the same time, welcome OEM, ODM orders, invite friends at home and abroad together common development and achieve win-win, integrity innovation, and expand business opportunities! If you have any question or need more information please feel free to contact us. We are looking forward to receiving your enquiries soon.

Hot Products

  • XC6SLX25T-N3CSG324I

    XC6SLX25T-N3CSG324I

    ​The XC6SLX25T-N3CSG324I Spartan-6 FPGA has up to six CMTs, each consisting of two DCMs and one PLL, and can be used alone or in a cascade. The Spartan-6 FPGA extends the density of 3840 to 147443 logic units, with only half the power consumption of the previous Spartan series, and has faster and more comprehensive connectivity. The Spartan-6 series adopts mature 45 nanometer low-power copper process technology, achieving the best balance of cost, power consumption, and performance, providing a new and more efficient dual register 6-input lookup table logic and rich built-in system level blocks.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU025-1FFVA1156I

    XCKU025-1FFVA1156I

    ​XCKU025-1FFVA1156I is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • XCVU13P-L2FHGC2104E

    XCVU13P-L2FHGC2104E

    ​XCVU13P-L2FHGC2104E I did not directly find the exact corresponding information for the detailed introduction of XCVU13P-L2FHGC2104E, but I can provide a general overview based on the information of similar models XCVU13P-2FHGB2104E in the search results, as well as the general characteristics of FPGA (Field Programmable Gate Array).
  • XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEFA7U19A7N

    5CEFA7U19A7N

    ​The 5CEFA7U19A7N device can simultaneously meet the requirements of continuously decreasing power consumption, cost, and time to market, as well as the increasing bandwidth requirements of large-scale and cost sensitive applications.

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