6-layer any interconnection PCB Manufacturers

We have been proud from the higher consumer gratification and wide acceptance due to our persistent pursuit of high quality both on product or service and service for 6-layer any interconnection PCB,8-layer 3Step HDI PCB,Cross Blind Buried Hole PCB,HDI PCB,4Step HDI PCB, With the eternal goal of "continuous quality improvement, customer satisfaction", we are sure that our product quality is stable and reliable and our products are best-selling at home and abroad.
6-layer any interconnection PCB, We will supply much better products with diversified designs and professional services. At the same time, welcome OEM, ODM orders, invite friends at home and abroad together common development and achieve win-win, integrity innovation, and expand business opportunities! If you have any question or need more information please feel free to contact us. We are looking forward to receiving your enquiries soon.

Hot Products

  • Buried resistor PCB

    Buried resistor PCB

    Buried resistor PCB--The backplane has always been a specialized product in the PCB manufacturing industry. The backplane is thicker and heavier than conventional PCB boards, and accordingly its heat capacity is also larger.The following is about Double sided Pressfit Backdrill Board related, I hope to help you better understand Double sided Pressfit Backdrill Board.
  • EP3C25F324C8N

    EP3C25F324C8N

    ​EP3C25F324C8N is an FPGA (Field Programmable Gate Array) belonging to the Cyclone III series, designed and produced by Intel/Altera. This FPGA has the following features and specifications:
  • BCM43694B1KRFBG

    BCM43694B1KRFBG

    BCM43694B1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2C384-7TQG144C

    XC2C384-7TQG144C

    XC2C384-7TQG144C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S1000-4FGG456I

    XC3S1000-4FGG456I

    XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I

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