Products
Home > Products > Cross Blind Buried Hole PCB

Cross Blind Buried Hole PCB Manufacturers

We always think and practice corresponding to the change of circumstance, and grow up. We goal at the achievement of a richer mind and body and also the living for Cross Blind Buried Hole PCB,Laser Blind Buried Hole PCB,4-layer via-in-PAD PCB,VIA-in-PAD PCB,VIA in PAD PCB, Make sure you sense absolutely absolutely free to speak to us for organization. nd we believe we are going to share the ideal trading practical experience with all our merchants.
Cross Blind Buried Hole PCB, Many kinds of different goods are available for you to choose, you can do one-stop shopping here. And customized orders are acceptable. Real business is to get win-win situation, if possible, we would like to provide more support for customers. Welcome all nice buyers communicate details of products with us!!

Related Products

Hot Products

  • XC6SLX25T-N3CSG324I

    XC6SLX25T-N3CSG324I

    ​The XC6SLX25T-N3CSG324I Spartan-6 FPGA has up to six CMTs, each consisting of two DCMs and one PLL, and can be used alone or in a cascade. The Spartan-6 FPGA extends the density of 3840 to 147443 logic units, with only half the power consumption of the previous Spartan series, and has faster and more comprehensive connectivity. The Spartan-6 series adopts mature 45 nanometer low-power copper process technology, achieving the best balance of cost, power consumption, and performance, providing a new and more efficient dual register 6-input lookup table logic and rich built-in system level blocks.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU025-1FFVA1156I

    XCKU025-1FFVA1156I

    ​XCKU025-1FFVA1156I is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • XCVU13P-L2FHGC2104E

    XCVU13P-L2FHGC2104E

    ​XCVU13P-L2FHGC2104E I did not directly find the exact corresponding information for the detailed introduction of XCVU13P-L2FHGC2104E, but I can provide a general overview based on the information of similar models XCVU13P-2FHGB2104E in the search results, as well as the general characteristics of FPGA (Field Programmable Gate Array).
  • XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEFA7U19A7N

    5CEFA7U19A7N

    ​The 5CEFA7U19A7N device can simultaneously meet the requirements of continuously decreasing power consumption, cost, and time to market, as well as the increasing bandwidth requirements of large-scale and cost sensitive applications.
  • Related Blog
  • Reviews

Related Search

28-layer cross blind buried hole PCB

Send Inquiry