28-layer cross blind buried hole PCB Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" could be the persistent conception of our organization for your long-term to establish alongside one another with shoppers for mutual reciprocity and mutual benefit for 28-layer cross blind buried hole PCB,40-layers 6.4MM thick PCB,48-layer back-drilled PCB, As a key business of this industry, our company makes endeavours to become a leading supplier, based on the faith of specialist quality & throughout the world company.
28-layer cross blind buried hole PCB, Our aim is to help customers realize their goals. We have been making great efforts to achieve this win-win situation and sincerely welcome you to join us. In a word, when you choose us, you choose a perfect life. Welcome to visit our factory and welcome your order! For further inquiries, remember to do not hesitate to contact us.

Hot Products

  • XC7A50T-1CSG324C

    XC7A50T-1CSG324C

    XC7A50T-1CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU085-3FLVA1517E

    XCKU085-3FLVA1517E

    ​XCKU085-3FLVA1517E is a high-performance FPGA product from Xilinx, packaged in BGA-1517. This FPGA has an astonishing 1088325 logic components, enabling it to handle extremely complex logic operations. Meanwhile, it has 672 I/O ports, making data transmission and interaction more efficient.
  • 5CSEBA6U19I7N

    5CSEBA6U19I7N

    ​5CSEBA6U19I7N is a SoC FPGA (Field Programmable Gate Array) produced by Altera (Intel), which has high performance and rich functional features. Here is a detailed introduction about 5CSEBA6U19I7N
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • 13 layer R5775G high-speed PCB

    13 layer R5775G high-speed PCB

    In the design of 13 layer R5775G high-speed PCB, the main problems that must be considered are signal integrity, electromagnetic compatibility and thermal noise. Generally, when the signal frequency is higher than 30MHz, the signal distortion must be prevented. When the frequency is higher than 66MHz, the signal integrity must be analyzed.
  • XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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