Products
Home > Products > 48-layer back-drilled PCB

48-layer back-drilled PCB Manufacturers

Our pursuit and corporation intention is to "Always satisfy our client requirements". We continue to develop and style remarkable high-quality items for each our outdated and new shoppers and accomplish a win-win prospect for our customers likewise as us for 48-layer back-drilled PCB,28-layer cross blind buried hole PCB,40-layers 6.4MM thick PCB, Welcome to setup long-term romantic relationship with us. Best Value Permanently Top quality in China.
48-layer back-drilled PCB, Now we have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and professional after-sale service supplied by our consultant group has happy our buyers. In depth Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Related Products

Hot Products

  • XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LT3650IDD-4.2

    LT3650IDD-4.2

    LT3650IDD-4.2 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-2CSG325C

    XC7A35T-2CSG325C

    XC7A35T-2CSG325C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K355T-1FFG901I

    XC7K355T-1FFG901I

    XC7K355T-1FFG901I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTM4644IY-1#PBF

    LTM4644IY-1#PBF

    LTM4644IY-1#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX048H3F34I2LG

    10AX048H3F34I2LG

    10AX048H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • What characteristics do semiconductor materials possess

    Semiconductor materials refer to materials with special electrical properties in electronics and quantum mechanics, including silicon, germanium, silicon nitride, gallium selenide, etc. The special properties of these materials enable them to be used as materials in electronic devices, such as transistors, diodes, solar cells, etc.

  • What types of FPC circuit boards can be divided according to the number of layers

    FPC circuit board can be divided into single panel, double-sided board and multilayer board according to the number of circuit layers. The common multilayer board is generally 4-layer board or 6-layer board, and the complex multilayer board can reach dozens of layers.

  • What is a chip? How to classify

    From "Why are chips stuck" to "How can the shortage of chips be alleviated", we can clearly feel that everyone has a much deeper understanding of the importance of chips. However, when many students contact the chip industry and want to know more, they will still have a variety of questions to answer!

  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

  • What is a high-speed PCB design?

    ‌High-speed PCB design‌ refers to circuit boards designed for transmitting high-speed signals, which are usually transmitted at speeds in GHz (gigahertz).

  • Do you really know about FPCs

    of FPC is becoming more and more significant in order to achieve more functions. Now Jin Baize will talk about the characteristics of FPC on the advantages and disadvantages of FPC.

Send Inquiry