XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications:
Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits.
Number of logic elements/units: With 52160 logic elements/units, it provides powerful logic processing capabilities.
Working temperature range: -40 ° C to 100 ° C (TJ), suitable for various working environment temperatures.
Total RAM bits: With a total RAM of 2764800 bits, it meets the needs of big data processing.
I/O count: With 210 I/O interfaces, it is easy to connect and exchange data with other devices.
Supplier Device Packaging: 324-CSPBGA (15x15), which is a compact and efficient packaging form suitable for space constrained applications.
