Industry News

Precautions for FPC flexible circuit board packaging

2022-04-20
FPC flexible circuit board packaging skills and precautions:
Special attention should also be paid to the packaging of finished products of flexible circuit boards, rather than simply stacking an appropriate number of flexible boards together at will. Due to the complex structure of flexible printed board, it is easy to be damaged by a little external force. Therefore, special care must be taken in packaging flexible printed board.
The commonly used packaging method is to stack 10 ~ 20 FPCs of flexible circuit boards together, roll each part with paper tape and fix it on the cardboard. The use of tape should be avoided, because the chemical substances contained in the tape adhesive are easy to cause oxidation and discoloration of the terminal if they seep out. When the base film is polyimide film, because it is easy to absorb moisture, FPC of flexible printed board shall be put into polyethylene bag together with desiccant such as silica gel and the bag mouth shall be sealed. Then put them and cushioning materials into corrugated boxes. Due to the unique shape of FPC, different packaging methods should be adopted according to different shapes.
Multilayer PCB is to press multiple layers into a circuit board by pressing process after they are completed. In order to reduce cost and via interference, multilayer PCB is often not much thicker than double-layer board and single-layer board, which makes the thickness of the board layer constituting Multilayer PCB is smaller and the mechanical strength is lower than that of ordinary double-layer board and single-layer board, resulting in higher requirements for processing. Therefore, the manufacturing cost of Multilayer PCB is much more expensive than ordinary double-layer board and single-layer board.
Some FPCs are pasted on the polyester supporting sheet coated with weak adhesive before punching the shape, and then half cut the shape with a knife die (embedded punching). In this way, they are handed over to the user intact. The user can take down the FPC of the flexible circuit board for assembly, or assemble it first, and then remove it from the polyester supporting film after assembly. This method can only be used for small-size products, which can greatly improve the process efficiency for both FPC manufacturers and users.
The safest and most reliable way is to use special pallets. Firstly, the pallets should be equipped according to the varieties. Although the management is troublesome, the quality is guaranteed and the use is convenient, which is conducive to user assembly. The cost is not high and can be discarded after use.

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