As an indispensable core component in modern electronic devices, HDI boards (high-density interconnect boards) are widely used in multiple technology-intensive fields due to their high precision, high integration and high reliability.
As an important electronic component carrier, double-sided boards have been widely used in modern electronic devices due to their unique double-layer wiring structure.
As a key component in modern electronic devices, high-speed boards are widely used in communication, computing, consumer electronics, and industrial control.
High-frequency PCB boards refer to special circuit boards with higher electromagnetic frequencies. They are used in high-frequency and microwave fields. They are produced by using some processes of ordinary rigid circuit board manufacturing methods or special processing methods on microwave substrate copper-clad boards.
Multi-layer PCBs can meet the needs of lightweight and miniaturized electronic equipment, reduce the connection between components, and are simple to install and highly reliable.
High-speed PCB design refers to circuit boards designed for transmitting high-speed signals, which are usually transmitted at speeds in GHz (gigahertz).
