16-layer 2step HDI PCB Manufacturers

Adhering towards the theory of "quality, support, efficiency and growth", we've attained trusts and praises from domestic and international client for 16-layer 2step HDI PCB,6-layer 2step HDI PCB,14-layer 4step HDI PCB, We are expecting to cooperate with you on the basis of mutual benefits and common development. We will never disappoint you.
16-layer 2step HDI PCB, Due to our dedication, our products are well known throughout the world and our export volume continuously grows every year. We will continue to strive for excellence by providing high quality products that will exceed the expectation of our customers.

Hot Products

  • EM-526 High-speed PCB

    EM-526 High-speed PCB

    EM-526 High-speed PCB, with the rapid development of electronic technology, more and more large-scale integrated circuits (LSI) are used. At the same time, the use of deep submicron technology in IC design makes the integration scale of the chip larger.
  • 5SGXMA3H2F35C2LN

    5SGXMA3H2F35C2LN

    ​5SGXMA3H2F35C2LN is an FPGA (Field Programmable Gate Array) product produced by Intel Corporation, belonging to the Stratix V GX series. This FPGA has 957 logic units (LABs) and 432 input/output (I/O) terminals, making it suitable for applications that require highly programmable logic solutions.
  • EP2SGX90FF1508C4N

    EP2SGX90FF1508C4N

    EP2SGX90FF1508C4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications
  • BCM54616SC0KFBG

    BCM54616SC0KFBG

    BCM54616SC0KFBG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM81328A0KFSBG

    BCM81328A0KFSBG

    BCM81328A0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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