16-layer 2step HDI PCB Manufacturers

Adhering towards the theory of "quality, support, efficiency and growth", we've attained trusts and praises from domestic and international client for 16-layer 2step HDI PCB,6-layer 2step HDI PCB,14-layer 4step HDI PCB, We are expecting to cooperate with you on the basis of mutual benefits and common development. We will never disappoint you.
16-layer 2step HDI PCB, Due to our dedication, our products are well known throughout the world and our export volume continuously grows every year. We will continue to strive for excellence by providing high quality products that will exceed the expectation of our customers.

Hot Products

  • XCZU4EG-2FBVB900I

    XCZU4EG-2FBVB900I

    ​XCZU4EG-2FBVB900I is an FPGA programmable logic device chip launched by Xilinx. This chip belongs to the Virtex-6 series and has the characteristics of high performance and high integration, suitable for various complex application scenarios
  • XC7Z045-2FFG676I

    XC7Z045-2FFG676I

    ​XC7Z045-2FFG676I is a high-performance SoC (System on Chip) FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Zynq-7000 series
  • XC6SLX100T-3FGG900I

    XC6SLX100T-3FGG900I

    XC6SLX100T-3FGG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7VX690T-3FFG1930I

    XC7VX690T-3FFG1930I

    XC7VX690T-3FFG1930I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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