EM-891 HDI PCB Manufacturers

In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of EM-891 HDI PCB,EM-891K HDI PCB,EM-528 HDI PCB,EM-526 HDI PCB,EM-890 HDI PCB, Now we have a skilled team for international trade. We will solve the problem you meet. We can present the goods you want. Be sure to feel cost-free to contact us.
EM-891 HDI PCB, More than 26 years, Expert companies from all over the world take us as their long-term and stable partners. We're keeping durable business relationship with more than 200 wholesalers in Japan, Korea, USA, UK, Germany, Canada, France, Italian, Poland, South Africa, Ghana, Nigeria etc.

Hot Products

  • XAZU2EG-1SFVC784Q

    XAZU2EG-1SFVC784Q

    XAZU2EG-1SFVC784Q based on Xilinx ® UltraScale MPSoC architecture. This product integrates a feature rich 64 bit quad core Arm ® Cortex-A53 and dual core Arm Cortex-R5 processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • XC7A200T-2SBG484C

    XC7A200T-2SBG484C

    ​XC7A200T-2SBG484C is a high-performance FPGA chip produced by Xilinx. This chip plays a crucial role in multiple application scenarios due to its powerful functionality and flexibility. Here are some detailed introductions about XC7A200T-2SBG484C:
  • XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C

    XC6VLX240T-2FFG1759C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • 10M08DCU324I7G

    10M08DCU324I7G

    ​10M08DCU324I7G is a single-chip, non-volatile, low-cost programmable logic device (PLD) used for integrating the best system components. The highlights of 10M08DCU324I7G include: dual configuration flash memory for internal storage, user flash memory, support for instant boot, integrated analog-to-digital converter (ADC), and support for single-chip Nios II soft core processors. The 10M08DCU324I7G is an ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer electronics products.
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA

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