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Multilayer layers HDI PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    AD102-300-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    ​XC7K325T-2FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XC6SLX25-2CSG324C

    XC6SLX25-2CSG324C

    ​XC6SLX25-2CSG324C is a powerful, flexible and programmable FPGA chip with high performance, flexible programmability, rich communication interfaces, support for IP cores, and low power consumption. ‌‌
  • XCVU190-2FLGB2104I

    XCVU190-2FLGB2104I

    ​XCVU190-2FLGB2104I Virtex ® UltraScale FPGAs: High capacity, high-performance FPGAs implemented using single-chip and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance by integrating various system level functionalities to meet critical market and application requirements.
  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.
  • XCZU27DR-2FFVE1156I

    XCZU27DR-2FFVE1156I

    ​XCZU27DR-2FFVE1156I integrates a single chip direct RF sampling data converter on an adaptive SoC, eliminating the need for external data converters, thus achieving a highly flexible solution. Compared with multi-component solutions, this solution can reduce power consumption and space occupation by 50%, including eliminating high power FPGA analog interfaces such as JESD204
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