Multilayer layers HDI PCB Manufacturers

With our abundant working experience and thoughtful companies, we now have been identified as a reliable supplier for numerous global potential buyers for Multilayer layers HDI PCB,4-layer HDI PCB,PCB Circuit board,8layer HDI PCB, We've been hunting forward to forming effective business marriage with new clients from the near upcoming!
Multilayer layers HDI PCB, We set a strict quality control system. We have now return and exchange policy, and you can exchange within 7 days after receive the wigs if it is in new station and we service repairing free for our solutions. Please feel free to contact us for further information and we will offer you competitive price list then.

Hot Products

  • S1D13700F02A100

    S1D13700F02A100

    S1D13700F02A100 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56265B0KFSBG

    BCM56265B0KFSBG

    The BCM56265B0KFSBG is a high-performance networking chip designed and manufactured by Broadcom Limited. Belonging to the esteemed StrataXGS family of switches, this chip offers a robust solution for a wide range of networking applications, including but not limited to enterprise networks, data centers, and service provider environments.
  • XCZU43DR-L2FFVG1517I

    XCZU43DR-L2FFVG1517I

    XCZU43DR-L2FFVG1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S50-5PQG208C

    XC2S50-5PQG208C

    XC2S50-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU2EG-2SFVC784E

    XCZU2EG-2SFVC784E

    XCZU2EG-2SFVC784E is a SoC FPGA manufactured by AMD/Xilinx. This FPGA combines ARM Cortex A53, ARM Cortex R5 processors, and ARM Mali-400 MP2 graphics processor

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