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Our pros are reduce price ranges,dynamic gross sales staff,specialized QC,potent factories,premium quality services for 2step HDI PCB,28-layer 3step HDI PCB,32-layer 3step HDI PCB,20-layer 6step HDI PCB,3step HDI PCB, We welcome all with the consumers and pals to call us for mutual positive aspects. Hope to do additional company along with you.
2step HDI PCB, Our company's main merchandise are widely used all over the world; 80% of our products exported to the United States, Japan, Europe and other markets. All stuff sincerely welcome guests come to visit our factory.

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    XC7VX485T-2FFG1157I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU085-2FLVA1517I

    XCKU085-2FLVA1517I

    ​XCKU085-2FLVA1517I has a power option to achieve the best balance between required system performance and low-power envelope. XCKU085-2FLVA1517I is an ideal choice for packet processing and DSP intensive features, suitable for various applications from wireless MIMO technology to Nx100G networks and data centers.
  • XC4VSX35-10FFG668I

    XC4VSX35-10FFG668I

    XC4VSX35-10FFG668I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM82380BKFSBG

    BCM82380BKFSBG

    BCM82380BKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • LTC5542IUH#TRPBF

    LTC5542IUH#TRPBF

    LTC5542IUH#TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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