6-layers 2Step HDI PCB Manufacturers

Often customer-oriented, and it's our ultimate target to become not only probably the most reputable, trustable and honest provider, but also the partner for our customers for 6-layers 2Step HDI PCB,12layer HDI PCB,14layer 4step HDI PCB,16layer 5step HDI PCB, Seeing believes! We sincerely welcome the new prospects abroad to set up company interactions and also expect to consolidate the interactions with all the long-established clients.
6-layers 2Step HDI PCB, Customer's satisfaction is always our quest, creating value for customers is always our duty, a long term mutual-beneficial business relationship is what we've been doing for. We are an absolutely reliable partner for yourself in China. Of course, other services, like consulting, can be offered too.

Hot Products

  • EM-370 PCB

    EM-370 PCB

    In the touch era, EM-370 PCB have been applied to various industrial equipment, such as industrial automation, gas station terminals, aircraft display screens, automotive GPS, medical equipment, bank POS and ATM machines, industrial measuring instruments, and high-speed rails, etc. Wait, a new industrial revolution is unfolding.The following is about4 layer EM-370 PCB, I hope to help you better understand 4 layer EM-370 PCB.
  • XCVU13P-2FLGA2104I

    XCVU13P-2FLGA2104I

    XCVU13P-2FLGA2104I is an FPGA chip produced by Xilinx, designed for optimizing workloads in data centers. This chip has the following characteristics and advantages:
  • XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • R-F775 FPC

    R-F775 FPC

    R-f775 FPC is a flexible circuit board made of r-f775 flexible material developed by songdian. It has stable performance, good flexibility and moderate price
  • HI-1579PSI

    HI-1579PSI

    HI-1579PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU19P-1FSVB3824E

    XCVU19P-1FSVB3824E

    ​XCVU19P-1FSVB3824E is an FPGA (Field Programmable Gate Array) produced by Xilinx, belonging to the Virtex UltraScale+series. This FPGA has the following key features:

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