16layer 5step HDI PCB Manufacturers

We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of 16layer 5step HDI PCB,12layer HDI PCB,14layer 4step HDI PCB,6-layers 2Step HDI PCB, Therefore, we could satisfy different inquiries from different clients. Remember to come across our web site to check additional facts from our items.
16layer 5step HDI PCB, Our products and solutions are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our solutions and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".

Hot Products

  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.
  • 5G test PCB

    5G test PCB

    Most of 5g products need 5g test PCB, which can be used normally after debugging. Therefore, 5g test PCB has become a popular product. Hontec specializes in producing communication PCB.
  • XC7K410T-1FBG676C

    XC7K410T-1FBG676C

    XC7K410T-1FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEBA4F17I7N

    5CEBA4F17I7N

    5CEBA4F17I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S15-2FTGB196C

    XC7S15-2FTGB196C

    XC7S15-2FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C80F780I7N

    EP3C80F780I7N

    EP3C80F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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