Products
Home > Products > 32-layer 3step HDI PCB

32-layer 3step HDI PCB Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for 32-layer 3step HDI PCB,28-layer 3step HDI PCB,20-layer 6step HDI PCB,2step HDI PCB,3step HDI PCB, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
32-layer 3step HDI PCB, Our aim is to help customers realize their goals. We have been making great efforts to achieve this win-win situation and sincerely welcome you to join us. In a word, when you choose us, you choose a perfect life. Welcome to visit our factory and welcome your order! For further inquiries, remember to do not hesitate to contact us.

Related Products

Hot Products

  • XCZU3EG-2SFVC784I

    XCZU3EG-2SFVC784I

    XCZU3EG-2SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VFX12-10SFG363I

    XC4VFX12-10SFG363I

    XC4VFX12-10SFG363I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1K30FC256-3N

    EP1K30FC256-3N

    EP1K30FC256-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SL150F1152C4N

    EP3SL150F1152C4N

    EP3SL150F1152C4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S50A-4FTG256C

    XC3S50A-4FTG256C

    XC3S50A-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Semiconductor returned with strength, underestimated value increased with high growth

    At the end of April 2022, we opened a special column called "when the weather turns good, we will copy the bottom 2022". By the end of June, we have focused more on the new energy industry tracks, including the upstream and downstream industrial chain of lithium batteries for new energy vehicles

  • What is a chip? How to classify

    From "Why are chips stuck" to "How can the shortage of chips be alleviated", we can clearly feel that everyone has a much deeper understanding of the importance of chips. However, when many students contact the chip industry and want to know more, they will still have a variety of questions to answer!

  • Detailed explanation of PCB circuit board via clogging solution

    Via hole is also called via hole. In order to meet customer requirements, the via holes must be plugged in the PCB process. Through practice, it has been found that in the process of plugging, if the traditional aluminum sheet plugging process is changed, and the white mesh is used to complete the board surface solder mask and plugging, the PCB production can be stable and the quality is reliable.

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding.

  • What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

    The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.

  • Features of PCB

    The reason why PCB can be used more and more widely is because it has many unique advantages

Send Inquiry