8 layer 2Step HDI PCB Manufacturers

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Hot Products

  • XCKU060-1FFVA1517C

    XCKU060-1FFVA1517C

    XCKU060-1FFVA1517C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 59,520 logic cells, 17.2 Mb of distributed RAM, 360 Digital Signal Processing (DSP) slices, and 1122 user input/output pins. It operates on a 0.95V to 1.05V power supply and supports various I/O standards such as LVCMOS, HSTL, and PCI Express.
  • XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD7687BRMZ

    AD7687BRMZ

    AD7687BRMZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD8622ARZ

    AD8622ARZ

    AD8622ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HCPL-0453-500E

    HCPL-0453-500E

    HCPL-0453-500E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-943R PCB

    TU-943R PCB

    TU-943R PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.

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