12 layer 3Step HDI PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC7K160T-L2FFG676I

    XC7K160T-L2FFG676I

    ​XC7K160T-L2FFG676I is used to connect to the host system. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture includes common components such as logic structure
  • EP2AGX125EF29C6G

    EP2AGX125EF29C6G

    EP2AGX125EF29C6G is a high-performance field programmable gate array (FPGA) chip produced by Intel (formerly Altera, now acquired by Intel), belonging to the Arria II GX series
  • ADUM3223ARZ

    ADUM3223ARZ

    ADUM3223ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Rogers antenna PCB

    Rogers antenna PCB

    Rogers antenna PCB has high dielectric constant, large loss and good heat dissipation, so it is widely used in high-power and small-volume devices.The following is about GE Rogers antenna , I hope to help you better understand GE Rogers antenna .
  • XC7K160T-1FBG676I

    XC7K160T-1FBG676I

    XC7K160T-1FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU27DR-2FFVE1156I

    XCZU27DR-2FFVE1156I

    ​XCZU27DR-2FFVE1156I integrates a single chip direct RF sampling data converter on an adaptive SoC, eliminating the need for external data converters, thus achieving a highly flexible solution. Compared with multi-component solutions, this solution can reduce power consumption and space occupation by 50%, including eliminating high power FPGA analog interfaces such as JESD204

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