10 layer 3Step HDI PCB Manufacturers

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Hot Products

  • 10M25DAF256C8G

    10M25DAF256C8G

    ​10M25DAF256C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). The chip has 25000 logic elements, supports 178 I/O ports, and is packaged in FBGA-256.
  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A50T-1FGG484I

    XC7A50T-1FGG484I

    ​XC7A50T-1FGG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XCZU9CG-L1FFVC900I

    XCZU9CG-L1FFVC900I

    XCZU9CG-L1FFVC900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX360KF40C4G

    EP4SGX360KF40C4G

    EP4SGX360KF40C4G Hongtai Quick Electronics is 100% in stock with a complete range of products. We only offer original products with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • XC7A75T-1FGG484C

    XC7A75T-1FGG484C

    XC7A75T-1FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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