10 layer 3Step HDI PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • BCM55045B1IFSBG

    BCM55045B1IFSBG

    BCM55045B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • S1000-2M PCB

    S1000-2M PCB

    S1000-2M PCB is made of S1000-2M material with TG value of 180. It is a good choice for Multilayer PCB with high reliability, high cost performance, high performance, stability and practicality
  • XC6SLX150-2FGG484C

    XC6SLX150-2FGG484C

    XC6SLX150-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-35930PQTF

    HI-35930PQTF

    HI-35930PQTF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-2FFVA1517E

    XCKU060-2FFVA1517E

    ​XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • 5AGXFA5H4F35I3G

    5AGXFA5H4F35I3G

    ​5AGXFA5H4F35I3G is a high-performance FPGA chip produced by Altera, belonging to the Arria V GX series, manufactured using advanced 20nm technology. This chip has the characteristics of high performance, low power consumption, and high density, and is suitable for high-speed digital signal processing, communication, image processing, and other fields.

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