XCVU13P-3FHGC2104E Virtex™ UltraScale+ ™ As the most powerful FPGA series in the industry, UltraScale+devices are the perfect choice for computationally intensive applications, ranging from 1+Tb/s networks, machine learning to radar/warning systems.
XCVU13P-3FHGC2104E Virtex™ UltraScale+ ™ As the most powerful FPGA series in the industry, UltraScale+devices are the perfect choice for computationally intensive applications, ranging from 1+Tb/s networks, machine learning to radar/warning systems.
This series of devices provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips, enabling operation above 600MHz and offering richer and more flexible clocks.
Main features and advantages
3D-on-3D integration:
-FinFET supporting 3D IC is suitable for breakthrough density, bandwidth, and large-scale die to die connections, and supports virtual single-chip design
Integrated blocks of PCI Express:
-Gen3 x16 integrated PCIe for 100G applications ® modular
Enhanced DSP Core:
-Up to 38 TOPs (22 TeraMAC) of DSP have been optimized for fixed floating point calculations, including INT8, to fully meet the needs of AI inference
