7step HDI PCB Manufacturers

Our organization sticks for the principle of "Quality will be the life of your business, and name may be the soul of it" for 7step HDI PCB,28-layer 3step HDI PCB,32-layer 3step HDI PCB,20-layer 6step HDI PCB,2step HDI PCB, Leading the trend of this field is our persistent objective. Supplying first class solutions is our intention. To create a beautiful upcoming, we wish to cooperate with all close friends in the home and overseas. Should you have got any interest in our products and solutions, remember to never wait to call us.
7step HDI PCB, We supply OEM services and replacement parts to meet the varying needs of our customers. We supply competitive price for quality goods and we are going to make certain your shipment is handled quickly by our logistics department. We sincerely hope to have the opportunity to meet with you and see how we can help you further your own business.

Hot Products

  • HI-6110PQI

    HI-6110PQI

    HI-6110PQI Patch installation QFP Differential 3.45V 3.15V 10mm*10mm*2mm Batch: 23+ Quantity: 104PCS
  • XCVU190-2FLGA2577I

    XCVU190-2FLGA2577I

    XCVU190-2FLGA2577I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • XC7VX690T-2FF1157I

    XC7VX690T-2FF1157I

    XC7VX690T-2FF1157I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADV7181DBCPZ

    ADV7181DBCPZ

    ADV7181DBCPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry