Any interconnect HDI PCB Manufacturers

Our personnel are generally in the spirit of "continuous improvement and excellence", and together with the outstanding top quality merchandise, favorable price tag and fantastic after-sales solutions, we try to gain every single customer's rely on for Any interconnect HDI PCB,VIA-in-PAD PCB,VIA in PAD PCB,HDI PCB,ELIC HDI PCB, Warmly welcome to cooperate and develop with us! we will continue to provide product with high quality and competitive price.
Any interconnect HDI PCB, Over the years, with high-quality solutions, first- class service, ultra-low prices we win thee trust and favor of customers. Nowadays our products sell all over the domestic and abroad. Thanks for the regular and new customers support. We offer high quality product and competitive price, welcome the regular and new customers cooperate with us!

Hot Products

  • EM-890K HDI PCB

    EM-890K HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and laser direct drilling are used.The following is about EM-890K HDI PCB related, I hope to help you better understand EM-890K HDI PCB.
  • XCVU125-2FLVB1760E

    XCVU125-2FLVB1760E

    XCVU125-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-3FLGB2104E

    XCVU11P-3FLGB2104E

    ​XCVU11P-3FLGB2104E Virtex™ UltraScale+ ™ FPGA devices provide the highest performance and integrated functionality on 14nm/16nm FinFET nodes.
  • XC7VX485T-2FFG1158C

    XC7VX485T-2FFG1158C

    XC7VX485T-2FFG1158C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TPS62003DGSR

    TPS62003DGSR

    TPS62003DGSR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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