Any interconnect HDI PCB Manufacturers

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Hot Products

  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU5CG-L1SFVC784I

    XCZU5CG-L1SFVC784I

    ​XCZU5CG-L1SFVC784I has 64 bit processor scalability, combining real-time control with software and hardware engines for graphics, video, waveform, and packet processing. Multi processor on-chip system devices are built on standard real-time processors and platforms equipped with programmable logic.
  • 10AX115U2F45I2SG

    10AX115U2F45I2SG

    ​10AX115U2F45I2SG 0AX115U2F45I2SG is a high-performance FPGA that uses a 20 nm process. The Arria ® 10 GX FPGA supports chip to chip data transfer rates of up to 17.4 Gbps, backplane data transfer rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • HI-8591PST

    HI-8591PST

    HI-8591PST is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2FGGA484I

    XC7S50-2FGGA484I

    XC7S50-2FGGA484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.

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