While electronic design is constantly improving the performance of the whole machine, it is also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, "small" is an eternal pursuit. High-density integration (HDI) technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency. HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method. The more build-up times, the higher the technical grade of the board. Ordinary
HDI boards are basically one-time build-up. High-end HDI uses two or more build-up techniques, while using advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling. High-end
HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.
Development prospects: According to the use of high-end HDI boards-3G boards or IC carrier boards, its future growth is very rapid: the world's 3G mobile phones will increase by more than 30% in the next few years, and China will soon issue 3G licenses; IC carrier board industry consultation The organization Prismark predicts that China's predicted growth rate from 2005 to 2010 is 80%, which represents the direction of PCB technology development.
