Internet of Things Module HDI PCB Manufacturers

Our firm insists all along the quality policy of "product high quality is base of organization survival; consumer fulfillment could be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" along with the consistent purpose of "reputation 1st, purchaser first" for Internet of Things Module HDI PCB,Bluetooth module HDI PCB,WIFI module HDI PCB, With us your money in risk-free your company in safe and sound . Hope we are able to be your trustworthy supplier in China . Seeking forward for your cooperation .
Internet of Things Module HDI PCB, With its rich manufacturing experience, high-quality products, and perfect after-sale service, the company has gained good reputation and has become one of the famous enterprise specialized in manufacturing series.We sincerely hope to establish business relation with you and pursue mutual benefit.

Hot Products

  • XC3S1500L-4FGG320C

    XC3S1500L-4FGG320C

    XC3S1500L-4FGG320C ​Number of Logic Components: Based on the characteristics of the Spartan-3 series, this model may contain thousands to tens of thousands of logic components, but specific values need to be referred to in the data manual
  • XCVU11P-1FLGC2104E

    XCVU11P-1FLGC2104E

    ​The XCVU11P-1FLGC2104E FPGA device provides the highest performance and integrated functionality on a 14nm/16nm FinFET node.
  • XC6SLX45T-3CSG324C

    XC6SLX45T-3CSG324C

    XC6SLX45T-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I ​The device not only provides scalability for 64 bit processors, but also combines real-time control with software and hardware engines to support graphics, video, waveform, and packet processing. The XCZU2CG-L1SBVA484I (CG) device adopts dual core Cortex technology ™- A53 and dual core Cortex ™- A heterogeneous processing system composed of R5 real-time processing units. This device is the best choice for industrial motor control and sensor fusion
  • EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S50-1FGGA484I

    XC7S50-1FGGA484I

    XC7S50-1FGGA484I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 52,160 Logic Cells, operates at a speed of up to 300 MHz, and features 2.1 Mb of Block RAM, 100 DSP Slices, and 46 user I/Os.

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