8layers 3Step HDI PCB Manufacturers

We've been also focusing on improving upon the stuff management and QC program to make sure that we could hold fantastic gain in the fiercely-competitive enterprise for 8layers 3Step HDI PCB,8layers 2Step HDI PCB,10layers 3Step HDI PCB,HDI PCB, Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!
8layers 3Step HDI PCB, Only for accomplishing the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment. We always think about the question on the side of the customers, because you win, we win!

Hot Products

  • XC6SLX45-2CSG324I

    XC6SLX45-2CSG324I

    XC6SLX45-2CSG324I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 43,661 Logic Cells, operates at a speed of up to 400 MHz, and features 1.3 Mb of Block RAM, 180 DSP Slices, and 167 user I/Os.
  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU27P-3FIGD2104I

    XCVU27P-3FIGD2104I

    XCVU27P-3FIGD2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EG-1FBVB900E

    XCZU7EG-1FBVB900E

    XCZU7EG-1FBVB900E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-2CPG236C

    XC7A35T-2CPG236C

    XC7A35T-2CPG236C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8598PSMF

    HI-8598PSMF

    ​Galvanic Isolation: HI-8598PSMF is the world's first ARINC 429 line driver to use galvanic isolation technology, providing an isolation voltage of 800V to ensure isolation between the ARINC 429 data bus and sensitive digital circuits, which is particularly important for safety critical systems.

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