8layers 3Step HDI PCB Manufacturers

We've been also focusing on improving upon the stuff management and QC program to make sure that we could hold fantastic gain in the fiercely-competitive enterprise for 8layers 3Step HDI PCB,8layers 2Step HDI PCB,10layers 3Step HDI PCB,HDI PCB, Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!
8layers 3Step HDI PCB, Only for accomplishing the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment. We always think about the question on the side of the customers, because you win, we win!

Hot Products

  • 5CEFA9F23I7N

    5CEFA9F23I7N

    5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.
  • R-F775 FPC

    R-F775 FPC

    R-f775 FPC is a flexible circuit board made of r-f775 flexible material developed by songdian. It has stable performance, good flexibility and moderate price
  • Double sided RO4350B PCB

    Double sided RO4350B PCB

    The high-frequency control board is mainly composed of a high-frequency induction heating main control board and two drives. The high-frequency board technology uses SG3525A as a PWM pulse. The output pulse frequency range is 20KHZ-60KHZ, the pulse interval is 180 degrees, and the dead time You can adjust it yourself. The following is about Double sided RO4350B PCB related, I hope to help you better understand Double sided RO4350B PCB.
  • Rogers 4350B PCB

    Rogers 4350B PCB

    The high-frequency mixed-press printed circuit board includes an aluminum base layer and an insulating and thermally conductive layer. The circuit board is provided with mounting holes. The bottom of the aluminum base layer is bonded and connected to the carbon cladding through a silicon rubber layer. The aluminum base layer, the insulating and thermally conductive layer, and the silicon rubber layer A rubber layer is adhesively connected to the outer end of the carbon cladding, and kraft paper is bonded to the bottom of the carbon cladding, which can prevent moist moisture from contaminating it, avoiding it from being eroded, saving costs, and improving efficiency. The following is about Rogers 4350B PCB related, I hope to help you better understand Rogers 4350B PCB.
  • EP4SGX180FF35I4N

    EP4SGX180FF35I4N

    EP4SGX180FF35I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP2AGX190EF29C6G

    EP2AGX190EF29C6G

    EP2AGX190EF29C6G is a high-performance field programmable gate array (FPGA) chip produced by Intel (formerly Altera, now acquired by Intel), belonging to the Arria II GX series

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