What is FPC
FPC (flexible circuit board) is a type of PCB, also known as "soft board". FPC is made of flexible substrates such as polyimide or polyester film, which has the advantages of high wiring density, light weight, thin thickness, bendability, and high flexibility, and can withstand millions of dynamic bending without damaging the wires , has advantages that other types of circuit boards cannot match.
Multilayer FPC circuit board
Application: Mobile Phone
Focus on the light weight and thin thickness of the flexible circuit board. It can effectively save the product volume, and easily connect the battery, the microphone, and the button into one.
Computer and LCD screen
Using the integrated circuit configuration of the flexible circuit board and the thin thickness, the digital signal is converted into a picture and presented through the LCD screen;
CD Walkman
Focus on the three-dimensional assembly characteristics and thin thickness of the flexible circuit board, and turn the huge CD into a good companion to carry around;
disk drive
Regardless of hard disk or floppy disk, it is very dependent on the high flexibility of FPC and the ultra-thin thickness of 0.1mm to complete fast reading of data, whether it is PC or NOTEBOOK;
new use
The components of the suspension circuit (Suinensi. n cireuit) of the hard disk drive (HDD, hard disk drive) and the xe package board.
future development
Based on the vast FPC market in China, large companies from Japan, the United States, and Taiwan have already set up factories in China. By 2012, flexible circuit boards, like rigid circuit boards, have made great progress. However, if a new product follows the principle of "start-development-climax-decline-elimination", FPC is now in the area between the climax and decline. Before there is no product that can replace the flexible board, the flexible board will continue to occupy the market share , it must innovate, and only innovation can make it jump out of this vicious circle.
In what aspects will FPC continue to innovate in the future?
1. Thickness. The thickness of FPC must be more flexible and thinner;
2. Folding resistance. Bending is an inherent characteristic of FPC. In the future, the folding resistance of FPC must be stronger and must exceed 10,000 times. Of course, this requires a better substrate;
3. Price. At this stage, the price of FPC is much higher than that of PCB. If the price of FPC comes down, the market will definitely be much wider.
4. Technological level. In order to meet various requirements, the FPC process must be upgraded, and the smallest aperture and smallest line width/line spacing must meet higher requirements.
Therefore, the relevant innovation, development and upgrading of FPC from these four aspects can make it usher in the second spring!
What is PCB
PCB (Printed Circuit Board), the Chinese name is printed circuit board, abbreviated as printed circuit board, is one of the important components of the electronics industry. Almost every electronic device, ranging from electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . In a larger electronic product research process, the most fundamental success factor is the design, documentation, and manufacture of the product's printed board. The design and manufacturing quality of printed boards directly affect the quality and cost of the entire product, and even lead to the success or failure of business competition.
The role of PCB
The role of PCB After the electronic equipment adopts the printed board, due to the consistency of the same type of printed board, the error of manual wiring is avoided, and the automatic insertion or mounting of electronic components, automatic soldering, and automatic detection can be realized, ensuring the electronic The quality of the equipment improves labor productivity, reduces costs, and facilitates maintenance.
Development of PCB
Printed boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their respective development trends. Due to the continuous development in the direction of high precision, high density and high reliability, continuous reduction in size, cost reduction and performance improvement, the printed board still maintains a strong vitality in the development of electronic equipment in the future.
A summary of the development trends of future printed board manufacturing technology at home and abroad is basically the same, that is, to high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multi-layer, high-speed transmission, light weight, The development of thin type, in production, is to improve productivity, reduce costs, reduce pollution, and adapt to the direction of multi-variety and small batch production. The technical development level of printed circuits is generally represented by the line width, aperture, and board thickness/aperture ratio on the printed circuit board.
