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22 layers of 3step HDI PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC7S6-1FTGB196I

    XC7S6-1FTGB196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XC3S200A-4VQG100C

    XC3S200A-4VQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM8073CIFBG

    BCM8073CIFBG

    BCM8073CIFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM5337MKQMG

    BCM5337MKQMG

    BCM5337MKQMG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • EP2AGX95EF35I5G

    EP2AGX95EF35I5G

    EP2AGX95EF35I5G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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    Just like the standard PCB manufacturing method, heavy copper PCB manufacturing requires more delicate processing.

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