22 layers of 3step HDI PCB Manufacturers

Sticking to the principle of "Super Good quality, Satisfactory service" ,We are striving to become an excellent organization partner of you for 22 layers of 3step HDI PCB,24 layers ELIC HDI PCB,26 layers of 2step HDI PCB, Our goal is always to enable clients comprehend their plans. We have been creating good endeavours to accomplish this win-win scenario and sincerely welcome you to join us.
22 layers of 3step HDI PCB, Each year, many of our customers would visit our company and achieve great business advancements working with us. We sincerely welcome you to visit us at any time and together we will prevail to a greater success in the hair industry.

Hot Products

  • VIA in PAD PCB

    VIA in PAD PCB

    The via-in-PAD is an important part of the multilayer PCB. It not only bears the performance of the main functions of the PCB, but also uses the via-in-PAD to save space.The following is about VIA in PAD PCB related, I hope to help you better understand VIA in PAD PCB.
  • XCVU29P-2FSGA2577I

    XCVU29P-2FSGA2577I

    ​XCVU29P-2FSGA2577I is an electronic component from Xilinx, specifically part of the UltraScale+FPGA (Field Programmable Gate Array) series. The following is a detailed introduction to XCVU29P-2FSGA2577I:
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • XC7Z035-2FFG676I

    XC7Z035-2FFG676I

    XC7Z035-2FFG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10M08SAU169C8G

    10M08SAU169C8G

    ​10M08SAU169C8G is an FPGA chip from Altera (now Intel), which is a field programmable gate array. This chip is packaged in UBGA-169 and has a delivery cycle of 12 weeks, and is currently still in production. It is priced at approximately 584.599 yuan and provides various technical support documents including data manuals. In addition, 10M08SAU169C8G is provided by four suppliers worldwide, including AiPCBA, Airui, Lichuang Mall, and Verical

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