EM-LXE HDI PCB Manufacturers

We will constantly satisfy our respected customers with our good excellent, superior value and superior assistance due to we're additional experienced and far more hard-working and do it in cost-effective way for EM-LXE HDI PCB,6layer HDI PCB,14layer HDI PCB,EM-890K HDI PCB,16layer HDI PCB, Welcome globally consumers to speak to us for small business and long-term cooperation. We're going to be your reliable partner and supplier of auto parts and accessories in China.
EM-LXE HDI PCB, Abiding by our motto of "Hold well the quality and services, Customers Satisfaction", So we provide our clients with high quality products and excellent service. Please feel free to contact us for further information.

Hot Products

  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • XCKU040-1FFVA1156C

    XCKU040-1FFVA1156C

    ​XCKU040-1FFVA1156C is a high-performance, low-power FPGA (Field Programmable Gate Array) chip that demonstrates strong application potential and is widely used in various fields such as industrial automation, smart homes, medical equipment, and transportation. With its high performance, low power consumption, and programmability, this chip plays an irreplaceable role in multiple fields.
  • EPM3064ATI100-10N

    EPM3064ATI100-10N

    EPM3064ATI100-10N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S150E-6FGG456C

    XC2S150E-6FGG456C

    XC2S150E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • DS3231MZ+TRL

    DS3231MZ+TRL

    DS3231MZ+TRL is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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