6-layer Matte Black HDI PCB Manufacturers

Our firm has been concentrating on brand strategy. Customers' pleasure is our best advertising. We also supply OEM company for 6-layer Matte Black HDI PCB,HDI Circuit board,Small BGA Via in PAD hole PCB,6-layers of any interconnected HDI PCB,any interconnected HDI PCB, Our company is working through the procedure principle of "integrity-based, cooperation created, people oriented, win-win cooperation". We hope we can have a pleasant relationship with businessman from all around the earth.
6-layer Matte Black HDI PCB, we always keep our credit and mutual benefit to our client, insist our high quality service to moving our clients. always welcome the our friends and clients to come and visit our company and guid our business, if you are interested in our goods, you can also submit your purchase information online, and we'll contact you immediately, we keep our highly sincere cooperation and wish everything in your side are all well.

Hot Products

  • XCKU3P-2FFVB676I

    XCKU3P-2FFVB676I

    ​The processing system of XCKU3P-2FFVB676I chip is very powerful and competitive for any available ASSP device. It supports complex architectures and can use a management program (guest operating system version running Linux) to perform various tasks such as control level,
  • BCM6756A1KFEBG

    BCM6756A1KFEBG

    BCM6756A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.BCM6756A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A50T-1FGG484C

    XC7A50T-1FGG484C

    XC7A50T-1FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • 5SGXMA4H2F35I3G

    5SGXMA4H2F35I3G

    5SGXMA4H2F35I3G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10CL040YU484I7G

    10CL040YU484I7G

    10CL040YU484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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