1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.
2. Increase the circuit density of HDI PCB: the interconnection of traditional circuit boards and parts.
3. Conducive to the use of advanced construction technology.
4. Have better electrical performance and signal accuracy.
5. Better reliability.
6. Can improve thermal properties.
7. It can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD).
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