6-layer ELIC HDI PCB Manufacturers

We insist over the principle of enhancement of 'High high quality, Efficiency, Sincerity and Down-to-earth working approach' to offer you with superb assistance of processing for 6-layer ELIC HDI PCB,ELIC Rigid-Flex PCB,12-layer ELIC HDI PCB,10-layer ELIC HDI PCB,8-layer ELIC HDI PCB, Top quality, timely company and Aggressive cost, all win us a superior fame in xxx field despite the international intense competition.
6-layer ELIC HDI PCB, Most problems between suppliers and clients are due to poor communication. Culturally, suppliers can be reluctant to question points they do not understand. We break down those barriers to ensure you get what you want to the level you expect, when you want it. Faster delivery time and the product you want is our Criterion .

Hot Products

  • XCZU2CG-2SFVC784I

    XCZU2CG-2SFVC784I

    XCZU2CG-2SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S15-2CPGA196I

    XC7S15-2CPGA196I

    ​XC7S15-2CPGA196I Spartan ® -7 Field Programmable Gate Array adopts 28 nanometer technology and is equipped with MicroBlaze ™ Soft processor, running over 200 DMIPs, supporting 800Mb/s DDR3
  • Super thick PCB

    Super thick PCB

    Super thick PCB refers to the PCB whose thickness is more than 6 mm. This kind of PCB is generally used in large equipment, machinery, communication and other equipment
  • XC7Z010-3CLG225E

    XC7Z010-3CLG225E

    XC7Z010-3CLG225E is an FPGA (Field Programmable Gate Array) chip based on ARM Cortex-A9 processor launched by Xilinx. This chip integrates SoC (System on a Chip) architecture, which has the characteristics of high performance and high flexibility
  • EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU15P-2FFVE1517E

    XCKU15P-2FFVE1517E

    XCKU15P-2FFVE1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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