8-layer ELIC HDI PCB Manufacturers

With this motto in mind, we now have turn out to be amongst quite possibly the most technologically innovative, cost-efficient, and price-competitive manufacturers for 8-layer ELIC HDI PCB,ELIC Rigid-Flex PCB,12-layer ELIC HDI PCB,10-layer ELIC HDI PCB,6-layer ELIC HDI PCB, We have been keeping chasing WIN-WIN problem with our purchasers. We warmly welcome consumers from everywhere in the planet coming in excess of for a visit and establishing long-term connection.
8-layer ELIC HDI PCB, Our main objectives are to provide our customers worldwide with good quality, competitive price, satisfied delivery and excellent services. Customer satisfaction is our main goal. We welcome you to visit our showroom and office. We're looking forward to establish business relation with you.

Hot Products

  • XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC7VX690T-2FF1158I

    XC7VX690T-2FF1158I

    XC7VX690T-2FF1158I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 6.8 million logic cells, operates at a speed of up to 800 MHz,
  • 5CGTFD9E5F35C7N

    5CGTFD9E5F35C7N

    ​5CGTFD9E5F35C7N is an FPGA (Field Programmable Gate Array) chip belonging to the Cyclone V GT series of the Altera brand. This chip is packaged in 1152-BGA and is suitable for various complex digital signal processing and communication applications. The main features of the 5CGTFD9E5F35C7N chip include high-performance processing capability, low-power design, rich I/O interfaces, and programmability. Specifically:
  • XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry