8-layer robot 3-step HDI PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for 8-layer robot 3-step HDI PCB,8-layer 2-step drone HDI PCB,HD camera HDI PCB,HDI PCB, We can do your customized order to meet your own satisfactory! Our company sets up several departments, including production department, sales department, quality control department and sevice center, etc.
8-layer robot 3-step HDI PCB, We accomplish this by exporting our wigs directly from our own factory to you. The goal of our company is to get customers who enjoy coming back to their business. We sincerely hope to cooperate with you in the near future. If there's any opportunity, welcome to visit our factory!!!

Hot Products

  • mmWave PCB

    mmWave PCB

    mmwave PCB-Wireless devices and the amount of data they process increase exponentially every year (53% CAGR). With the increasing amount of data generated and processed by these devices, the wireless communication mmwave PCB connecting these devices must continue to develop to meet the demand.
  • BCM54616SC0HKFBG

    BCM54616SC0HKFBG

    BCM54616SC0HKFBG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX100T-2CSG484C

    XC6SLX100T-2CSG484C

    XC6SLX100T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 24G High frequency PCB

    24G High frequency PCB

    24G High frequency PCB--24GHz microstrip array antenna, select 10mil or 20mil thickness for small array, 20mil thickness for large array, and 10mil thickness for RF board.The following is about 24G High frequency PCB, I hope to help you better understand 24G High frequency PCB.
  • XC2S150E-6FGG456C

    XC2S150E-6FGG456C

    XC2S150E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU115-3FLVA1924E

    XCKU115-3FLVA1924E

    The XCKU115-3FLVA1924E architecture includes high-performance FPGA, MPSoC, and RFSoC series, which can meet a wide range of application requirements. System requirements, with a focus on reducing total power consumption through numerous innovative technologies

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