Products
Home > Products > 3-step HDI PCB

3-step HDI PCB Manufacturers

Adhering towards the theory of "quality, support, efficiency and growth", we've attained trusts and praises from domestic and international client for 3-step HDI PCB,6-Layer HDI PCB,via-in-PAD PCB,2-step HDI PCB, We are expecting to cooperate with you on the basis of mutual benefits and common development. We will never disappoint you.
3-step HDI PCB, We have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and specialist after-sale service supplied by our consultant group has happy our buyers. Detailed Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Related Products

Hot Products

  • 5CSEMA4U23I7N

    5CSEMA4U23I7N

    ​5CSEMA4U23I7N is a SoC FPGA chip produced by Altera (now part of Intel Programmable Solutions Group). The chip is packaged in UBGA-672 and features an ARM Cortex A9 core with a dual core design. It supports a maximum clock frequency of up to 925MHz and is equipped with abundant logic elements and memory resources
  • EPF6016QC208-2N

    EPF6016QC208-2N

    EPF6016QC208-2N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z030-2FBG484I

    XC7Z030-2FBG484I

    XC7Z030-2FBG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM53426A0KFSBG

    BCM53426A0KFSBG

    BCM53426A0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • XC3S400AN-4FGG400C

    XC3S400AN-4FGG400C

    XC3S400AN-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

Related Search

8-layer robot 3-step HDI PCB

Send Inquiry