20-Layer Rigid-Flex PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC7S6-1FTGB196I

    XC7S6-1FTGB196I

    XC7S6-1FTGB196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-3FGG484C

    XC6SLX25-3FGG484C

    XC6SLX25-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C

    XC7A200T-2FFG1156C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-3FTG256I

    XC6SLX25-3FTG256I

    XC6SLX25-3FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VSX315T-1FF1156I

    XC6VSX315T-1FF1156I

    XC6VSX315T-1FF1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU115-2FLVA1517E

    XCKU115-2FLVA1517E

    ​XCKU115-2FLVA1517E is an FPGA chip produced by Xilinx, belonging to the Kintex UltraScale architecture, with high performance and low power consumption characteristics. This chip adopts second-generation 3D integrated circuit technology and has over 1.5 million system logic units and 624 input/output ports, which can be flexibly configured for various applications

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