20-Layer Rigid-Flex PCB Manufacturers

To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for 20-Layer Rigid-Flex PCB,18-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, We warmly welcome you to set up cooperation and generate a bright long term together with us.
20-Layer Rigid-Flex PCB, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Hot Products

  • LT8390IUFD#PBF

    LT8390IUFD#PBF

    LT8390IUFD#PBF also provides input or output current monitoring and power good indication, supporting the adjustment of output voltage and input or output current within the input voltage range of 4V to 60V.
  • XC4VSX35-11FF668C

    XC4VSX35-11FF668C

    ​XC4VSX35-11FF668C is a Virtex-4 series FPGA chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include supporting rich logical units and I/O resources,
  • 20-layer PCB

    20-layer PCB

    20-layer PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
  • 10M02SCU169I7G

    10M02SCU169I7G

    ​10M02SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics. It provides 130 I/O ports and is packaged in UBGA-169. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz.
  • XC3S1400A-4FGG676C

    XC3S1400A-4FGG676C

    XC3S1400A-4FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM3128ATC100-10N

    EPM3128ATC100-10N

    EPM3128ATC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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