20-Layer Rigid-Flex PCB Manufacturers

To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for 20-Layer Rigid-Flex PCB,18-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, We warmly welcome you to set up cooperation and generate a bright long term together with us.
20-Layer Rigid-Flex PCB, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Hot Products

  • 14 Layer IC Test Board

    14 Layer IC Test Board

    Because of the actual manufacturing process and the more or less defects in the material itself, no matter how perfect the product is, it will produce bad individuals, so testing has become one of the indispensable projects in integrated circuit manufacturing.The following is about 14 Layer IC Test Board related, I hope to help you better understand 14 Layer IC Test Board.
  • XC18V04VQG44C

    XC18V04VQG44C

    XC18V04VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C120F780I7N

    EP3C120F780I7N

    EP3C120F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CEBA4F17I7N

    5CEBA4F17I7N

    5CEBA4F17I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TerraGreen PCB

    TerraGreen PCB

    Terragreen PCB is a kind of high-speed material developed by Isola company in the United States. It uses FR4 to perfectly combine with hydrocarbon, with stable performance, low dielectric, low loss and easy processing
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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