20-Layer Rigid-Flex PCB Manufacturers

To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for 20-Layer Rigid-Flex PCB,18-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, We warmly welcome you to set up cooperation and generate a bright long term together with us.
20-Layer Rigid-Flex PCB, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Hot Products

  • BCM63136SVKFSBG

    BCM63136SVKFSBG

    BCM63136SVKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-1SBG484I

    XC7A200T-1SBG484I

    ​XC7A200T-1SBG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • 10AX066H3F34I2LG

    10AX066H3F34I2LG

    10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • IMX174LLJ-C

    IMX174LLJ-C

    IMX174LLJ-C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S100E-6PQG208C

    XC2S100E-6PQG208C

    XC2S100E-6PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU9P-2FLGA2104I

    XCVU9P-2FLGA2104I

    As a member of the FPGA chip, XCVU9P-2FLGA2104I has 2304 programmable logic units (PLs) and 150MB of internal memory, providing a clock frequency of up to 1.5 GHz. Provided 416 input/output pins and 36.1 Mbit distributed RAM. It supports field programmable gate array (FPGA) technology and can achieve flexible design for various applications

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