AP8515E Rigid-Flex PCB Manufacturers

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Hot Products

  • XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC7VX690T-2FF1158I

    XC7VX690T-2FF1158I

    XC7VX690T-2FF1158I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 6.8 million logic cells, operates at a speed of up to 800 MHz,
  • 5CGTFD9E5F35C7N

    5CGTFD9E5F35C7N

    ​5CGTFD9E5F35C7N is an FPGA (Field Programmable Gate Array) chip belonging to the Cyclone V GT series of the Altera brand. This chip is packaged in 1152-BGA and is suitable for various complex digital signal processing and communication applications. The main features of the 5CGTFD9E5F35C7N chip include high-performance processing capability, low-power design, rich I/O interfaces, and programmability. Specifically:
  • XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C

    XC7VX690T-2FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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