XCVU11P-3FLGB2104E Virtex™ UltraScale+ ™ FPGA devices provide the highest performance and integrated functionality on 14nm/16nm FinFET nodes.
XCVU11P-3FLGB2104E Virtex™ UltraScale+ ™ FPGA devices provide the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips, enabling operation above 600MHz and offering richer and more flexible clocks.
As the most powerful FPGA series in the industry, UltraScale+devices are the perfect choice for computationally intensive applications, ranging from 1+Tb/s networks, machine learning to radar/warning systems.
Main features and advantages
3D-on-3D integration:
-FinFET supporting 3D IC is suitable for breakthrough density, bandwidth, and large-scale die to die connections, and supports virtual single-chip design
Integrated blocks of PCI Express:
-Gen3 x16 integrated PCIe for 100G applications ® modular
Enhanced DSP Core:
-Up to 38 TOPs (22 TeraMAC) of DSP have been optimized for fixed floating point calculations, including INT8, to fully meet the needs of AI inference
