12-layer impedance control PCB Manufacturers

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Hot Products

  • ISOLA FR408 High Frequency PCB

    ISOLA FR408 High Frequency PCB

    For general frequency, use FR-4 sheet, but high-frequency materials should be used in the frequency ratio of 1-5G, such as semi-ceramic materials. ROGERS 4350, 4003, 5880, etc. are commonly used ... If the frequency is higher than 5G, it is best to use PTFE material, which is polytetrafluoroethylene. This material has good high-frequency performance, but there are limitations in the processing arts, such as the surface technology that cannot be hot air leveled. The following is about ISOLA FR408 High Frequency PCB related, I hope to help you better understand ISOLA FR408 High Frequency PCB.
  • XCZU21DR-2FFVD1156E

    XCZU21DR-2FFVD1156E

    XCZU21DR-2FFVD1156E is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA belongs to the Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) family and has 1,143,000 System Logic Cells, operates at a speed of up to 1.2 GHz, and features a 6-Input Processor System (PS), 242 Mb of UltraRAM,
  • XCKU15P-L2FFVE1517E

    XCKU15P-L2FFVE1517E

    XCKU15P-L2FFVE1517E is a Virtex UltraScale+ FPGA chip from Xilinx, a leading provider of programmable logic solutions. This chip is part of Xilinx's high-performance Virtex UltraScale+ series and features 15 million logic cells and 3,840 DSP slices.
  • EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.
  • XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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