16-layer blind buried via PCB Manufacturers

We stick to our enterprise spirit of "Quality, Performance, Innovation and Integrity". We purpose to create a lot more price for our prospects with our rich resources, innovative machinery, experienced workers and great products and services for 16-layer blind buried via PCB,plating hard gold PCB,14-layer impedance control PCB,Hard gold PCB, You would not have any communication problem with us. We sincerely welcome prospects all around the planet to call us for business enterprise cooperation.
16-layer blind buried via PCB, Our company now has many department, and there have more than 20 employees in our company. We set up sales shop, show room, and product warehouse. In the meantime, we registered our own brand. We have tightened inspection for quality of product.

Hot Products

  • XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 100G optoelectronic PCB

    100G optoelectronic PCB

    100G optoelectronic PCB is a packaging substrate for a new generation of high computing, which integrates light with electricity, transmits signals with light and operates with electricity. It adds a layer of light guide to the traditional printed circuit board, which is very mature at present.
  • HI-3585PQT

    HI-3585PQT

    The HI-3585PQT is a silicon gate CMOS device designed to interface a Serial Peripheral Interface (SPI) enabled microcontroller to the ARINC 429 serial bus. This device serves as a terminal IC that allows for efficient communication between microcontrollers and the ARINC 429 protocol, commonly used in avionics and other industrial applications
  • XC9572XL-10VQG64C

    XC9572XL-10VQG64C

    ​XC9572XL-10VQG64C is a complex programmable logic device (CPLD) produced by Xilinx. The chip is packaged in VQFP-64 and has 64 pins, of which 52 are I/O pins. It has built-in flash memory, supports system programmability, and has a maximum clock frequency of up to 100 MHz,
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.
  • EP2S30F672I4N

    EP2S30F672I4N

    EP2S30F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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