16-layer blind buried via PCB Manufacturers

We stick to our enterprise spirit of "Quality, Performance, Innovation and Integrity". We purpose to create a lot more price for our prospects with our rich resources, innovative machinery, experienced workers and great products and services for 16-layer blind buried via PCB,plating hard gold PCB,14-layer impedance control PCB,Hard gold PCB, You would not have any communication problem with us. We sincerely welcome prospects all around the planet to call us for business enterprise cooperation.
16-layer blind buried via PCB, Our company now has many department, and there have more than 20 employees in our company. We set up sales shop, show room, and product warehouse. In the meantime, we registered our own brand. We have tightened inspection for quality of product.

Hot Products

  • 5CSTFD6D5F31I7N

    5CSTFD6D5F31I7N

    ​The Cyclone V devices of 5CSTFD6D5F31I7N are divided into commercial and industrial grades. The speed levels of commercial devices are - C6 (fastest), - C7, and - C8. The speed level of industrial grade devices is - I7. The speed level of automotive grade equipment is - A7.
  • EP1K50FC256-3N

    EP1K50FC256-3N

    EP1K50FC256-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ADSP-21060LCW-160

    ADSP-21060LCW-160

    ADSP-21060LCW-160 Package: 240-BFCQFP bare pad Working temperature: -40-100 Lot number: 2023+ Quantity: 260PCS in the global hot sale
  • 10AX027H4F34I3SG

    10AX027H4F34I3SG

    ​10AX027H4F34I3SG is an Arria 10 GX field programmable gate array (FPGA) integrated circuit. Higher performance than the previous generation of mid to high end FPGAs. Realize high energy efficiency through a complete set of energy-saving technologies.
  • BCM6304A1KMLG

    BCM6304A1KMLG

    BCM6304A1KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

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